Designing Materials with Ultimate Thermal Property via Machine Learning

Shenghong Ju*, Hong Wang

Shanghai Jiao Tong University, Shanghai, 200240, China 

EXTENDED ABSTRACT: Exploring materials with ultra-high or ultra-low thermal transport properties has wide applications in the fields of thermal design of electronic devices and thermoelectric energy conversion. The traditional trial­and-error style is inefficient and costly. In this work,we introduce three successful cases by combining the machine learning and thermal transport calculations: (1) The exploring diamondlike latticethermal conductivity crystals via feature-basedtransfer learning, (2) The high-throughput screening of interfacial materials with high/low interfacial thermal conductance, (3) The designing of highthermal conductivity polymer monomers based on the high-throughput molecular dynamics simulations and interpretable machine learning. Those successful cases have shown great advantage of designing materals with ultimate thermal property via machine learning

Keywords: Machine learning; High-throughput screening; Polymers thermal conductivity; Interfacial thermal transport.Crvstal thermal conductivity.

REFERENCES

[l] S. Ju, R. Yoshida, C. Liu, et al., Physical Review Materials, 5(5), (2021) 053801.

[2] N. Wang, J. Jieensi, Z. Zhen, et al., 23rd International Conference on Electronic Packaging Technology(ICEPT), (2022) doi: 10.1109/ICEPT56209.2022.9872718.
[3] X. Huang, S. Ma, H. Wang, et al., International Journal of Heat and Mass Transfer 197, (2022) 123332.

[4] S. Ju, S. Shimizu, J. Shiomi, J. Appl. Phys., 128(16), (2020) 161102. 

Brief Introduction of Speaker
Shenghong Ju

Shenghong Ju received his B.S. degree from Nanjing University of Aeronautics and Astronautics in 2008, and he obtained his Ph.D. degree in Engineering Thermophysics from Tsinghua University in 2014. He conducted postdoctoral research in Ecole Centrale Paris and the University of Tokyo from 2014 to 2019. He is currently an associate professor in Shanghai Jiao Tong University. His research mainly focuses on the materials informatics and computational materials.