Abstract: The traditional single-component “trial and error method” for alloy composition development severely limits the development speed of new materials. In this study, a high throughput preparation method was selected to efficiently design and develop the Sn-9Zn based solder alloy. Cu-doped Sn-Zn-based solder alloy thin films were deposited by high-throughput method, and their mechanical properties and oxidation resistance were investigated by nanoindentation and digital image correlation method (DICM). It was found that Sn, Cu6Sn5 and Cu5Zn8 intermetallic compounds formed in the Sn-Zn-Cu thin films. Films with a Cu content of ~2 wt.% shows the highest Young’s modulus. With the Cu content increasing, XY compressive strains in the films gradually decrease and then become tensile strains. Meanwhile, the melting point becomes higher and the oxidation resistance appears weaker. Our results show the significant influence of alloying Cu in a broad compositional range on the properties of Sn-Zn-based solder, and demonstrate the combination of multi-target deposition as an effective way for rapidly developing lead-free solder.
Keywords: High-throughput method; Sn-Zn-Cu solder alloy; Young’s modulus; oxidation resistance

高通量法制备铜掺杂Sn-Zn-xCu (2.3≤x≤20.2)焊料合金的力学性能和 抗氧化性研究

耿川，贾延东，王刚* 上海大学材料科学与工程学院，材料研究所，上海 200444 

摘要:传统的合金成分研发的单成分“试错法”严重限制了新材料的开发速度。本研究选用高通 量制备方法，以高效设计、开发 Sn-9Zn 系焊料合金。本实验采用高通量方法制备铜掺杂 Sn-Zn 基焊料合金薄膜，并用纳米压痕和数字图像相关法(DICM)研究了其力学性能和抗氧化性。发现 Sn-Zn-Cu 薄膜中形成 Sn、Cu6Sn5 和 Cu5Zn8 金属间化合物。样品中铜含量约为 2 wt.%处得到最 大的杨氏模量。随着铜含量的增加，薄膜中的压应变逐渐减小，然后变为拉应变。同时，抗氧 化性变弱。结果表明，在较宽的组成范围内 Cu 掺杂对 Sn-Zn 基焊料的性能有显著影响，并证明了多靶共沉积的方法是快速发展无铅焊料的有效途径。

关键词:无铅焊料;高通量制备;杨氏模量;抗氧化性